Tools
Laser Decapper
Our laser decappers can target and remove the mold compound from the most intricate samples, on and off boards.
CNC Die Thinning
Our state of the art CNC mills can accurately remove silicon from the backside of components with micron accuracy. Touch off probes allow accurate package flattening prior to removal, and residual silicon thickness measurements can be acquired during deprocessing and following thinning to target 50 micron thicknesses or less.
Advanced Imaging
Our SEMs and optical microscopes offer the state of the art imaging capabilities to provide your team with the greatest data possible prior to, during, and following sample prep.