Radiation
Laser Decapsulation
Laser decapsulation utilizes state of the art laser ablation with minimal acid exposure to remove the encapsulant from ICs while maintaining full device functionality. ESD protection is upheld throughout the process, ensuring the highest success rate in the industry.
Die Thinning
Die thinning can be performed via CNC on die from 1mm x 1mm die up to 40mm x 40mm die, while utilizing warpage compensation down to 50 microns residual silicon thickness. Polishing can be provided ranging from matte finish down to mirror finish.
Cross Sectional Analysis
Interested in knowing the overall package thicknesses? Metal/dielectric BEOL thicknesses? Advanced cross sectioning techniques can provide invaluable data on layer thicknesses and composition to input into models for the most accurate exposure rates. SEM with EDS and TEM with EDS and EELS available.
Scanning Acoustic Microscopy
CSAM (C-mode scanning acoustic microscopy) is available for initial screening and post preparation screening of packages of all types. Ensure your packages are fully intact, free from die cracking, delamination, and anomalies prior to testing.